Prototyping

  • Manual wire welder model TPT HB 160

      Researcher visualizing electronic circuit and welding using the TPT HB 160 manual wire welder
      • Description: Manual wire bonding equipment to make interconnections between a microchip and other electronic components, as part of the semiconductor device manufacturing process.
      • Fabrication Year: 1990
  • Automatic Wire Welder ITM Bonda 101

      Overview of the Automatic Wire Welder ITM Bonda 101
      • Description: Automatic wire bonding equipment to make interconnections between a microchip and other electronic components, as part of the semiconductor device manufacturing process.
      • Fabrication Year: 2009
  • Hermetic Sealing Machine Solid State Equip. Co. model 1000 Parallel Splice

      Overview of the Hermetic Sealing Machine Solid State Equip. Co. model 1000 Parallel Splice
      • Description: Package sealer is designed for packaged devices. Manually-loaded parallel seam sealer that allows weld or solder sealing.
      • Fabrication Year: 2006
  • Resin paste / solder dispenser CAMALOT 1414

      Overview of the Resin paste / solder dispenser CAMALOT 1414
      • Description: CAMALOT 1414 is a stand-alone liquid dispensing system for applications in surface mount assembly, semiconductor packaging, industrial or automotive assembly, gasketing and R&D.
      • Fabrication Year: 2012
  • DIMA SMT HS 100 Stencil Welding Printer

      Researcher manipulating the DIMA SMT HS 100 stencil welding printer
      • Description: Robust Semi-automatic screen printer ideal for pastes. DMT HS100 Stencil accepts frames of up to 585 x 585mm, maximum print area is 450 x 400mm allowing board sizes varying from 40 x 40 to up to 520 x 400mm. The machine accuracy is ±25µm @ 3-sigma while the repeatability is ±10µm @ 3-sigma, enabling printing for a pitch of 0.3mm.
      • Fabrication Year: 2006
  • Pick and Place for SMD Essemtech Paraquda

      Overview of the Pick and Place equipment for SMD Essemtech Paraquda
      • Description: SMD Mounter and Pick and Place Equipment for circuit board assembly, perfect for quick changeovers and ideal for prototyping on small floor space.
      • Fabrication Year: 1998
  • BGA PACE ThermoFlo TF2000 rework station

      Overview of the BGA PACE ThermoFloTF2000 rework station
      • Description: The ThermoFlo TF200 unit is a complete system designed for hot air removal and installation of SMD components including Ball Grid Arrays (BGAs).
      • Fabrication Year: 2001
  • Mounting system Flip-Chip Semi Corp Eagle 860

      Researcher visualizing electronic circuit assembly in the Flip-Chip Semi Corp Eagle 860 assembly system
      • Description: Die bonder equipment for R & D and low volume production. Applications include solder and gold bumped flip chip, AuSn eutectic, thermosonic, thermocompression and epoxy die bonding. Ilumination system with light diodes and optical fibers, as well as a 14 " monitor with magnification from 20 to 200 x. XY work table, micrometric adjustments and a 101.6 mm square vacuum plate, it is accurate positioning of ± 5 µ, operates with matrices from 0.15 to 25.4 mm and offers productivity of 200 positions / h.
      • Fabrication Year: 2001
  • Reflow Oven Heller model 1088

      Overview of the Heller Reflow oven model 1088
      • Description: 8 heating zone forced convection reflow system with 4 heaters above and below the conveyor. Extra High Volume heating modules with maximum safe velocity gas glow for the ultimate in rapid and uniform heat transfer.
      • Fabrication Year: 2009