Processing

  • Dicing Saw Disco Corp model DAD 321

      Overview of the Dicing Saw Disco Corp model DAD 321
      • Description: Dicing saw with blades to cut silicon, glass, and ceramic workpieces with a high degree of accuracy. Fully automatic dicing saws performs the entire process sequence: loading from the cassette, alignment, dicing, cleaning/drying and unloading to the cassette.
      • Fabrication Year: 2011
  • Sputtering RF deposition system Kurt Lesker 3 Guns

      Researcher manipulating deposition system Sputtering RF Kurt Lesker 3 Guns
      • Description: The custom-made R&D Sputtering RF tool allows the deposition of insulating materials, transition metal oxide semiconductors and metal thin films on substrates up to 3" size.
      • Fabrication Year: 2012
  • Newport Pulse UV Laser Processing System model Pulseo

      Researcher manipulating Newport Pulse UV Laser Processing System model Pulseo
      • Description: High Power UV Q-Switched laser for micromachining, thin film patterning, nanomaterials synthesis and processing.
      • Fabrication Year: ----