Packaging and system integration open lab

LApacs occupies about 450 m² of completly renewed 100.000 and 10.000 class clean-room facilities allowing to carry out processes to interconnect electronic, mechanical, optical and photonic components into a single system. The IC packaging pilot line covers from dicing different substrates (e.g. silicon, ceramic, glass) to packaging in all conventional geometries by using microwiring with Au, Al and Cu and soldering into PCBs through MD, PTH and BGA/µBGA processes. Technologies like Flip-chip and Multi-chip module (MCM-D) are also available.

Capabilities

  • Design and prototyping
  • Proof-of-concept trials and tape-out
  • Small series fabrication
  • Consulting, courses and training
Panoramic image of the LApacs laboratory

FAQ

Open laboratories are learning environments with a multidisciplinary team and open access infrastructure to assist students, researchers, inventors, entrepreneurs and startups to collaboratively develop innovative products, processes, businesses and generate scientific knowledge. Source: MCTIC (adapted)
Users will have at their disposal machines, equipment and software to develop their research, products or processes. Users are trained to use the equipment and, with exceptions, will be able to operate it. The open laboratories provide a healthy environment for the exchange of ideas, experiences and enable the formation of partnerships and collaborative networks. Source: MCTIC (adapted) . Go to Information and find more details about how to use CTI’s open labs.
The spaces are intended for: researchers, students, companies, startups and inventors who want to develop their projects, whether for scientific dissemination or to put them on the market. Access is franchised through financial or non-financial consideration in accordance with CTI's innovation policy and internal regulations. Source: MCTIC (adapted) . Go to Information and find more details about how to use CTI’s open labs.